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Microelectronics and Reliability|April 9, 2013
Electromigration failure in a copper dual-damascene structure with a through silicon viaR L de Orio, H Ceric, S SelberherrMicroelectronics and Reliability|October 4, 2011
A compact model for early electromigration failures of copper dual-damascene interconnectsR L de Orio, H Ceric, S SelberherrAnnals of Physics|March 19, 2013
Physical scales in the Wigner-Boltzmann equationM Nedjalkov, S Selberherr, D K Ferry, et al.Pageof 1