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ACS Applied Materials & Interfaces
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January 25, 2023
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles
Seong Yeon Park, Seung Yoon On, Junmo Kim, et al.
ACS Applied Materials & Interfaces
|
August 3, 2023
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements
Seong Yeon Park, Seung Yoon On, Junmo Kim, et al.
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of 1
Search research articles
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Showing results (1-10 of 2) with videos related to
Sort By:
Page
of 1
ACS Applied Materials & Interfaces
|
January 25, 2023
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles
Seong Yeon Park, Seung Yoon On, Junmo Kim, et al.
ACS Applied Materials & Interfaces
|
August 3, 2023
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements
Seong Yeon Park, Seung Yoon On, Junmo Kim, et al.
Page
of 1