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Small (Weinheim an Der Bergstrasse, Germany)
|
December 28, 2023
Water-Triggered Self-Healing of Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub> MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process
Jun Sang Choi, Jagan Singh Meena, Su Bin Choi, et al.
Journal of Nanoscience and Nanotechnology
|
November 12, 2013
Synthesis of Ag nanowires for the fabrication of transparent conductive electrode
Jong-Woong Kim, Sung-Won Lee, Yeji Lee, et al.
ACS Applied Materials & Interfaces
|
February 2, 2023
Role of Oxygen in the Ti<sub>3</sub>AlC<sub>2</sub> MAX Phase in the Oxide Formation and Conductivity of Ti<sub>3</sub>C<sub>2</sub>-Based MXene Nanosheets
Su Bin Choi, Jung-Min Oh, Jagan Singh Meena, et al.
Journal of Nanoscience and Nanotechnology
|
September 29, 2015
Microwave Sintering of Silver Nanoink for Radio Frequency Applications
Kwang-Seok Kim, Bum-Geun Park, Kwang-Ho Jung, et al.
Journal of Nanoscience and Nanotechnology
|
November 30, 2011
Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate
Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, et al.
Journal of Nanoscience and Nanotechnology
|
April 2, 2011
Electrical characteristics of printed Ag nanopaste on polyimide substrate
Young-Chul Lee, Kwang-Seok Kim, Jong-Woong Kim, et al.
Materials (Basel, Switzerland)
|
January 14, 2021
Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, et al.
ACS Omega
|
November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging
Taejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
Journal of Nanoscience and Nanotechnology
|
May 12, 2015
Effect of Ag nanowire addition into nanoparticle paste on the conductivity of Ag patterns printed by gravure offset method
Ki-Hun Ok, Chan-Jae Lee, Min-Gi Kwak, et al.
Journal of Nanoscience and Nanotechnology
|
May 15, 2015
Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns
Minkwan Koh, Kwang-Seok Kim, Bum-Geun Park, et al.
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Search research articles
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Showing results (21-30 of 34) with videos related to
Sort By:
Page
of 4
Small (Weinheim an Der Bergstrasse, Germany)
|
December 28, 2023
Water-Triggered Self-Healing of Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub> MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process
Jun Sang Choi, Jagan Singh Meena, Su Bin Choi, et al.
Journal of Nanoscience and Nanotechnology
|
November 12, 2013
Synthesis of Ag nanowires for the fabrication of transparent conductive electrode
Jong-Woong Kim, Sung-Won Lee, Yeji Lee, et al.
ACS Applied Materials & Interfaces
|
February 2, 2023
Role of Oxygen in the Ti<sub>3</sub>AlC<sub>2</sub> MAX Phase in the Oxide Formation and Conductivity of Ti<sub>3</sub>C<sub>2</sub>-Based MXene Nanosheets
Su Bin Choi, Jung-Min Oh, Jagan Singh Meena, et al.
Journal of Nanoscience and Nanotechnology
|
September 29, 2015
Microwave Sintering of Silver Nanoink for Radio Frequency Applications
Kwang-Seok Kim, Bum-Geun Park, Kwang-Ho Jung, et al.
Journal of Nanoscience and Nanotechnology
|
November 30, 2011
Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate
Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, et al.
Journal of Nanoscience and Nanotechnology
|
April 2, 2011
Electrical characteristics of printed Ag nanopaste on polyimide substrate
Young-Chul Lee, Kwang-Seok Kim, Jong-Woong Kim, et al.
Materials (Basel, Switzerland)
|
January 14, 2021
Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, et al.
ACS Omega
|
November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging
Taejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
Journal of Nanoscience and Nanotechnology
|
May 12, 2015
Effect of Ag nanowire addition into nanoparticle paste on the conductivity of Ag patterns printed by gravure offset method
Ki-Hun Ok, Chan-Jae Lee, Min-Gi Kwak, et al.
Journal of Nanoscience and Nanotechnology
|
May 15, 2015
Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns
Minkwan Koh, Kwang-Seok Kim, Bum-Geun Park, et al.
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