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ACS Applied Materials & Interfaces
|
September 1, 2020
Interface State Reduction by Plasma-Enhanced Atomic Layer Deposition of Homogeneous Ternary Oxides
Steven A Vitale, Weilin Hu, Richard D'Onofrio, et al.
Small (Weinheim an Der Bergstrasse, Germany)
|
August 14, 2018
Valleytronics: Opportunities, Challenges, and Paths Forward
Steven A Vitale, Daniel Nezich, Joseph O Varghese, et al.
ACS Photonics
|
October 23, 2023
Time-Resolved Temperature Mapping Leveraging the Strong Thermo-Optic Effect in Phase-Change Materials
Nicholas A Nobile, John R Erickson, Carlos Ríos, et al.
Nature Communications
|
May 9, 2025
Microheater hotspot engineering for spatially resolved and repeatable multi-level switching in foundry-processed phase change silicon photonics
Hongyi Sun, Chuanyu Lian, Francis Vásquez-Aza, et al.
Nature Nanotechnology
|
April 27, 2023
Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform
Jiadi Zhu, Ji-Hoon Park, Steven A Vitale, et al.
Page
of 1
Search research articles
Search
Showing results (1-10 of 5) with videos related to
Sort By:
Page
of 1
ACS Applied Materials & Interfaces
|
September 1, 2020
Interface State Reduction by Plasma-Enhanced Atomic Layer Deposition of Homogeneous Ternary Oxides
Steven A Vitale, Weilin Hu, Richard D'Onofrio, et al.
Small (Weinheim an Der Bergstrasse, Germany)
|
August 14, 2018
Valleytronics: Opportunities, Challenges, and Paths Forward
Steven A Vitale, Daniel Nezich, Joseph O Varghese, et al.
ACS Photonics
|
October 23, 2023
Time-Resolved Temperature Mapping Leveraging the Strong Thermo-Optic Effect in Phase-Change Materials
Nicholas A Nobile, John R Erickson, Carlos Ríos, et al.
Nature Communications
|
May 9, 2025
Microheater hotspot engineering for spatially resolved and repeatable multi-level switching in foundry-processed phase change silicon photonics
Hongyi Sun, Chuanyu Lian, Francis Vásquez-Aza, et al.
Nature Nanotechnology
|
April 27, 2023
Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform
Jiadi Zhu, Ji-Hoon Park, Steven A Vitale, et al.
Page
of 1