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T P Moffat

Showing results (11-20 of 21) with videos related to

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Physical Review Letters|July 20, 2001
Superconformal electrodeposition in submicron featuresD Josell, D Wheeler, W H Huber, et al.
Journal of the Electrochemical Society|November 23, 2020
Simulation of Copper Electrodeposition in Through-Hole ViasT M Braun, D Josell, J John, et al.
Journal of the Electrochemical Society|October 12, 2020
Accelerated Bottom-Up Gold Filling of Metallized TrenchesD Josell, M E Williams, S Ambrozik, et al.
Journal of the Electrochemical Society|October 8, 2020
Effect of Chloride Concentration on Copper Deposition in Through Silicon ViasT M Braun, D Josell, M Silva, et al.
Journal of the Electrochemical Society|October 12, 2020
Bottom-Up Copper Filling of Millimeter Size Through Silicon ViasD Josell, L A Menk, A E Hollowell, et al.
Journal of the Electrochemical Society|March 20, 2023
Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon ViasS-H Kim, T M Braun, H-J Lee, et al.
Journal of the Electrochemical Society|October 8, 2020
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and PredictionT M Braun, S-H Kim, H-J Lee, et al.
Journal of the Electrochemical Society|March 20, 2023
Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon ViasS-H Kim, H-J Lee, T M Braun, et al.
Journal of the Electrochemical Society|March 20, 2023
Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray InterferometryD Josell, Z Shi, K Jefimovs, et al.
Journal of the Electrochemical Society|October 12, 2020
Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction GratingsD Josell, S Ambrozik, M E Williams, et al.
Pageof 3

Showing results (11-20 of 21) with videos related to

Sort By:
Pageof 3
Physical Review Letters|July 20, 2001
Superconformal electrodeposition in submicron featuresD Josell, D Wheeler, W H Huber, et al.
Journal of the Electrochemical Society|November 23, 2020
Simulation of Copper Electrodeposition in Through-Hole ViasT M Braun, D Josell, J John, et al.
Journal of the Electrochemical Society|October 12, 2020
Accelerated Bottom-Up Gold Filling of Metallized TrenchesD Josell, M E Williams, S Ambrozik, et al.
Journal of the Electrochemical Society|October 8, 2020
Effect of Chloride Concentration on Copper Deposition in Through Silicon ViasT M Braun, D Josell, M Silva, et al.
Journal of the Electrochemical Society|October 12, 2020
Bottom-Up Copper Filling of Millimeter Size Through Silicon ViasD Josell, L A Menk, A E Hollowell, et al.
Journal of the Electrochemical Society|March 20, 2023
Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon ViasS-H Kim, T M Braun, H-J Lee, et al.
Journal of the Electrochemical Society|October 8, 2020
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and PredictionT M Braun, S-H Kim, H-J Lee, et al.
Journal of the Electrochemical Society|March 20, 2023
Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon ViasS-H Kim, H-J Lee, T M Braun, et al.
Journal of the Electrochemical Society|March 20, 2023
Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray InterferometryD Josell, Z Shi, K Jefimovs, et al.
Journal of the Electrochemical Society|October 12, 2020
Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction GratingsD Josell, S Ambrozik, M E Williams, et al.
Pageof 3