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Superconformal electrodeposition in submicron features.

D Josell1, D Wheeler, W H Huber

  • 1National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.

Physical Review Letters
|July 20, 2001
PubMed
Summary
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Superconformal electrodeposition occurs when local growth speed increases with catalytic species on the copper interface. This phenomenon, observed in nano-features, is driven by interface area changes rather than electrolyte accumulation.

Area of Science:

  • Materials Science
  • Electrochemistry
  • Surface Science

Background:

  • Superconformal electrodeposition, crucial for microelectronics, relies on understanding surface kinetics.
  • Adsorbate species on interfaces significantly influence deposition morphology and growth rates.

Purpose of the Study:

  • To explain the mechanism of superconformal electrodeposition based on local growth velocity.
  • To model and experimentally validate copper deposition in nanoscale features.

Main Methods:

  • Development of a model based on local growth velocity dependent on catalytic species coverage.
  • Experimental validation using copper deposition in 350-100 nm features.
  • Simulations to analyze interface area changes and adsorbate accumulation.

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Main Results:

  • Local growth velocity is directly proportional to the coverage of catalytic species.
  • Superconformal growth in dilute catalyst precursor solutions is primarily due to interface area changes.
  • Adsorbate influence on roughness evolution in confined features was elucidated.

Conclusions:

  • The proposed model accurately explains superconformal electrodeposition.
  • Interface area dynamics play a critical role in achieving conformal filling in nanoscale features.
  • Understanding adsorbate effects is key to controlling roughness and enabling advanced fabrication.