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Additives for Superconformal Gold Feature Filling.

D Josell1, T P Moffat1

  • 1Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, MD.

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Summary
This summary is machine-generated.

Additives significantly impact gold electrodeposition, influencing the filling of recessed features. Heavy metal additives like lead (Pb2+) and bismuth (Bi3+) promote superconformal and bottom-up gold filling in trenches and vias.

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Area of Science:

  • Materials Science
  • Electrochemistry
  • Surface Engineering

Background:

  • Gold electrodeposition is crucial for metallization in microelectronics.
  • Achieving uniform and conformal filling of recessed features remains a challenge.

Purpose of the Study:

  • To review the effect of various additives on gold electrodeposition kinetics and morphology.
  • To understand additive influence on filling fully metallized recessed surface features like trenches and vias.

Main Methods:

  • Voltammetry and chronoamperometry were used to study deposition kinetics.
  • Microscopic analysis was implied for evaluating feature filling characteristics.

Main Results:

  • Heavy metal additives (Tl+, Pb2+, Bi3+, Sb3+) accelerate gold deposition kinetics and yield bright deposits.
  • Pb2+ and Bi3+ additives promote superconformal and bottom-up filling of sub-micrometer trenches.
  • Inhibitory additives (SeCN-, MPS, PEI) can also induce superconformal filling by breakdown of suppression in recessed areas.

Conclusions:

  • Additive selection is critical for controlling gold electrodeposition and achieving desired feature filling.
  • Specific additives offer pathways for advanced metallization strategies in microelectronic fabrication.