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TaeJoon Noh

Showing results (1-10 of 3) with videos related to

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Materials (Basel, Switzerland)|November 27, 2024
Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package IntegrationMiKyeong Choi, SeaHwan Kim, TaeJoon Noh, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|July 16, 2024
Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain-Insensitivity, and ReproducibilitySu Bin Choi, Taejoon Noh, Seung-Boo Jung, et al.
ACS Omega|November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass PackagingTaejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
Pageof 1

Showing results (1-10 of 3) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|November 27, 2024
Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package IntegrationMiKyeong Choi, SeaHwan Kim, TaeJoon Noh, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|July 16, 2024
Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain-Insensitivity, and ReproducibilitySu Bin Choi, Taejoon Noh, Seung-Boo Jung, et al.
ACS Omega|November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass PackagingTaejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
Pageof 1