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ACS Applied Materials & Interfaces|January 25, 2023
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure CyclesSeong Yeon Park, Seung Yoon On, Junmo Kim, et al.
Nanomaterials (Basel, Switzerland)|December 8, 2020
Creation of Curved Nanostructures Using Soft-Materials-Derived LithographyHyun-Ik Jang, Hae-Su Yoon, Tae-Ik Lee, et al.
Nanoscale|August 16, 2018
Stretchable thin-film transistors with molybdenum disulfide channels and graphene electrodesIck-Joon Park, Tae In Kim, Sumin Kang, et al.
Journal of Nanoscience and Nanotechnology|April 28, 2019
Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated CircuitSeungyoon Kim, Cheolgyu Kim, Jae Hoon Bong, et al.
Allergy, Asthma, and Clinical Immunology : Official Journal of the Canadian Society of Allergy and Clinical Immunology|February 1, 2022
Differences between Staphylococcus aureus nasal carriage and IgE-sensitization to Staphylococcus aureus enterotoxin on risk factors and effects in adult populationHan-Ki Park, Seok-Ju Yoo, Taek Soo Kim, et al.
Clinical Infectious Diseases : an Official Publication of the Infectious Diseases Society of America|November 4, 2024
Relationship Between Clarithromycin Minimum Inhibitory Concentrations and Treatment Responses in Mycobacterium avium Complex Pulmonary DiseaseJoong-Yub Kim, Hyeontaek Hwang, DaHae Yim, et al.
ACS Applied Materials & Interfaces|August 3, 2023
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating ElementsSeong Yeon Park, Seung Yoon On, Junmo Kim, et al.
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