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Materials (Basel, Switzerland)|May 25, 2024
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced PackagingTsan-Feng Lu, Ping-Yang Lee, YewChung Sermon WuNanomaterials (Basel, Switzerland)|May 10, 2024
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface ModificationTsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, et al.Materials (Basel, Switzerland)|July 27, 2024
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned CopperTsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, et al.Materials (Basel, Switzerland)|May 11, 2024
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding MechanismTsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu, et al.Materials (Basel, Switzerland)|July 13, 2024
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned CopperTsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, et al.Nanomaterials (Basel, Switzerland)|May 24, 2024
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled SurfacesTsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, et al.Pageof 1