Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Modular cytokinin evolution: Integrating heat stress and development during terrestrialization.

Trends in plant science·2026
Same author

Repurposing eravacycline as an immunomodulator for immunodeficiencies driven by anti-IFN-γ autoantibodies.

Translational research : the journal of laboratory and clinical medicine·2026
Same author

Biofunctional thermoresponsive gelatin-PNIPAm microcarriers with embedded zero-valent iron nanoparticles for enhanced human adipose-derived stem cell expansion and differentiation.

Biomaterials advances·2026
Same author

Triglyceride-glucose body mass index and risk of incident venous thromboembolism: a prospective cohort study from the UK Biobank.

European journal of medical research·2026
Same author

Stimuli-Responsive Nanozyme Reprograms Tumor Immunometabolism and Overcomes Therapeutic Resistance in Hepatocellular Carcinoma.

ACS nano·2026
Same author

Integrative Analysis of miR-21, PTEN, and Immune Signatures in Colorectal Cancer.

International journal of molecular sciences·2025

Related Experiment Video

Updated: Jun 18, 2025

Analysis of Contact Interfaces for Single GaN Nanowire Devices
11:13

Analysis of Contact Interfaces for Single GaN Nanowire Devices

Published on: November 15, 2013

9.4K

Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper.

Tsan-Feng Lu1, Yuan-Fu Cheng1, Pei-Wen Wang1

  • 1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Materials (Basel, Switzerland)
|July 27, 2024
PubMed
Summary

This study introduces a novel Cu-Cu bonding method to eliminate weak interfaces by leveraging grain size differences and nanotwinned structures. This approach enhances joint reliability for ultra-high-density packaging applications.

Keywords:
Cu–Cu direct bondinggrain boundary energygrain size distributiongrains and interfacesmicrostructurenanotwinned Cu

More Related Videos

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.7K
Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
08:50

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

Published on: September 2, 2015

8.8K

Related Experiment Videos

Last Updated: Jun 18, 2025

Analysis of Contact Interfaces for Single GaN Nanowire Devices
11:13

Analysis of Contact Interfaces for Single GaN Nanowire Devices

Published on: November 15, 2013

9.4K
Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.7K
Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
08:50

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

Published on: September 2, 2015

8.8K

Area of Science:

  • Materials Science
  • Metallurgy
  • Nanotechnology

Background:

  • Copper-copper (Cu-Cu) joints are crucial for ultra-high-density packaging in advanced electronics.
  • Low atomic diffusion at typical processing temperatures creates weak interfaces, compromising joint reliability.
  • Existing methods struggle to effectively eliminate these detrimental bonding interfaces.

Purpose of the Study:

  • To propose and investigate a new method for eliminating bonding interfaces in Cu-Cu joints.
  • To enhance the reliability of Cu-Cu interconnects for high-end electronic packaging.

Main Methods:

  • Utilized two types of Cu films with differing grain sizes for Cu-Cu bonding.
  • Leveraged grain size difference as the primary driving force for interface migration.
  • Employed columnar nanotwinned Cu structure as a secondary driving force to enhance migration.

Main Results:

  • Successfully eliminated bonding interfaces in Cu-Cu joints bonded at 300 °C.
  • Observed significant migration of bonding interfaces and interfacial grain boundaries.
  • Demonstrated grain growth from one Cu film extending across the interface.

Conclusions:

  • The proposed method effectively removes weak bonding interfaces in Cu-Cu joints.
  • Grain size difference and nanotwinned structures are key drivers for interface elimination.
  • This technique offers a promising solution for reliable ultra-high-density packaging.