Tsan-Feng Lu

6PUBLICATIONS
2CO-AUTHORS
Wearable materialsPowder and particle technologyComposite and hybrid materialsTransport properties and non-equilibrium processesEnergy generation, conversion and storage (excl. chemical and electrical)
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Publications (6)

|Jul 27, 2024
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper.

Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang

|Jul 13, 2024
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper.

Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng

|May 25, 2024
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging.

Tsan-Feng Lu, Ping-Yang Lee, YewChung Sermon Wu

|May 24, 2024
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces.

Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang

|May 11, 2024
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism.

Tsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu

|May 10, 2024
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification.

Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng

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Frequent Collaborators

5 joint publications

YewChung Sermon Wu

4 joint publications

Yuan-Fu Cheng