YewChung Sermon Wu

9PUBLICATIONS
10CO-AUTHORS
NanophotonicsWearable materialsPowder and particle technologyComposite and hybrid materialsTransport properties and non-equilibrium processes
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Publications (9)

|Jul 27, 2024
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper.

Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang

|May 25, 2024
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging.

Tsan-Feng Lu, Ping-Yang Lee, YewChung Sermon Wu

|May 24, 2024
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces.

Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang

|May 10, 2024
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification.

Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng

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