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Micromachines|December 31, 2025
An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing EnvironmentsZiyue Wang, Weikang Fang, Yichen Yang
Sensors (Basel, Switzerland)|April 28, 2023
An Improved Genetic Algorithm for Solving the Multi-AGV Flexible Job Shop Scheduling ProblemLeilei Meng, Weiyao Cheng, Biao Zhang, et al.
Micromachines|January 28, 2026
YOLO-LA: Prototype-Based Vision-Language Alignment for Silicon Wafer Defect Pattern DetectionZiyue Wang, Yichen Yang, Jianning Chu, et al.
Advanced Materials (Deerfield Beach, Fla.)|July 4, 2026
Unlocking Wafer-Scale 3D Photonic Systems With Ion-Beam-Induced OrigamiYi Wang, Ruixuan Zheng, Cai Luo, et al.
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