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Nanoscale Research Letters|January 21, 2017
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)Wen-Wei Shen, Kuan-Neng ChenJournal of Nanoscience and Nanotechnology|February 21, 2018
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection TechnologyWen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, et al.IEEE Transactions on Biomedical Circuits and Systems|January 11, 2015
2.5D heterogeneously integrated microsystem for high-density neural sensing applicationsPo-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, et al.Pageof 1