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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Wen-Wei Shen1, Kuan-Neng Chen2

  • 1Department of Electronics Engineering, National Chiao Tung University, Hsinchu, 300, Taiwan.

Nanoscale Research Letters
|January 21, 2017
PubMed

Keywords:
Three-dimensional integrated circuit (3D IC)Through-silicon via (TSV)

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