Kuan-Neng Chen

3PUBLICATIONS
0CO-AUTHORS
Composite and hybrid materialsPhotonic and electro-optical devices, sensors and systems (excl. communications)
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Publications (3)

|Dec 13, 2025
Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging.

Mu-Ping Hsu, Tai-Yu Lin, Hua-Jing Huang

|Sep 09, 2023
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung

|Jan 21, 2017
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).

Wen-Wei Shen, Kuan-Neng Chen

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