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Wonchul Do

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Micromachines|May 27, 2026

An Embedded Trace Redistribution Layer with Rounded-Bottom Cu Geometry and Ti Capping for Enhanced Electromigration ReliabilityWonchul Do, Jeongmin Ju, Minjin Kim, et al.

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Search research articles

Showing results (1-10 of 1) with videos related to

Sort By:

Pageof 1

Micromachines|May 27, 2026

An Embedded Trace Redistribution Layer with Rounded-Bottom Cu Geometry and Ti Capping for Enhanced Electromigration ReliabilityWonchul Do, Jeongmin Ju, Minjin Kim, et al.

Pageof 1