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Micromachines|August 28, 2025
Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) ModulesXuan-Bach Le, Won Yong Choi, Keejun Han, et al.Micromachines|November 27, 2024
Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical AnalysisXuan-Bach Le, Sung-Hoon ChoaMicromachines|November 27, 2025
Numerical Investigation of Crack Suppression Strategies in Ultra-Thin Glass Substrates for Advanced PackagingXuan-Bach Le, Kee-Youn Yoo, Sung-Hoon ChoaMicromachines|March 29, 2023
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted BondingXuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo, et al.Journal of Nanoscience and Nanotechnology|April 20, 2021
Development and Characteristics of Multipurpose Transparent Polyurethane FilmHyun Jin Nam, Sung-Hoon Choa, Se-Hoon ParkJournal of Nanoscience and Nanotechnology|March 3, 2021
Deformation Behavior of Various Interconnection Structures Using Fine Pitch Microelectromechanical Systems (MEMS) Vertical ProbeXuan Luc Le, Han Eul Lee, Sung-Hoon ChoaMicromachines|April 23, 2022
Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid BondingYeoun-Soo Kim, Thanh Hai Nguyen, Sung-Hoon ChoaJournal of Microbiological Methods|August 2, 2011
Diagnosis of Helicobacter pylori bacterial infections using a voltammetric biosensorSuw Young Ly, Hai-Soo Yoo, Sung Hoon ChoaMaterials (Basel, Switzerland)|November 9, 2024
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor ApplicationsMoses Gu, Hyunjin Nam, Sehoon Park, et al.Journal of Nanoscience and Nanotechnology|March 3, 2021
Highly Stretchable and Durable Nanocomposite Bow-Tie Antenna for Wearable ApplicationJi Hun Yuk, Inmu Kim, Hyun Jin Nam, et al.Pageof 3