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Related Experiment Video

Updated: Jun 8, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
04:54

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Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor

Moses Gu1, Hyunjin Nam2, Sehoon Park2

  • 1Intelligent Semiconductor Engineering Department, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.

Materials (Basel, Switzerland)
|November 9, 2024
PubMed
Summary

This study developed a robust, pressureless silver sinter-bonding technique for power semiconductors using bimodal silver paste and PMMA. The optimized process achieves high shear strength and void-free joints, crucial for reliable high-temperature applications.

Keywords:
PMMApressurelesssilver sinteringsinter-bonding

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Area of Science:

  • Materials Science and Engineering
  • Semiconductor Packaging Technology

Background:

  • Traditional bonding methods for power semiconductors face challenges with high temperatures and stresses.
  • Need for advanced joining techniques to ensure reliability and performance in demanding applications.

Purpose of the Study:

  • To develop a novel, pressureless silver sinter-bonding technology for power semiconductor packaging.
  • To investigate the influence of sintering parameters and additives on joint integrity and mechanical properties.

Main Methods:

  • Utilized a bimodal silver paste (nanoparticles and sub-micron particles) with polymethyl methacrylate (PMMA) additive.
  • Systematically studied the effects of sintering temperature (up to 350 °C) and PMMA content (optimal at 5 wt.%) on shear strength and microstructure.
  • Analyzed void formation and particle necking through microstructural examination.

Main Results:

  • Achieved a maximum shear strength of 41 MPa at 300 °C with minimal voids, attributed to PMMA-enhanced necking.
  • Observed a decrease in shear strength to 35 MPa at 350 °C due to substrate interface issues (cracks, voids) from thermal expansion mismatch.
  • Identified 5 wt.% PMMA as optimal for balancing thermal energy release and void minimization.

Conclusions:

  • The developed pressureless silver sintering technology offers a robust and void-free joining solution.
  • Demonstrates significant potential for high-reliability power semiconductor modules operating under extreme conditions.
  • PMMA additive plays a critical role in facilitating rapid, high-strength sinter-bonding.