Hyunjin Nam

4PUBLICATIONS
5CO-AUTHORS
GlassMicro- and nanosystemsCompound semiconductorsMetals and alloy materials
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Publications (4)

|Jun 26, 2026
Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review.

|Jun 26, 2026
Fabrication of Sub-10 μm Microvias Using Nanosecond UV Laser Drilling and a Sacrificial Metal Barrier Layer for Advanced Fine-Pitch Packaging.

|Nov 09, 2024
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications.

Moses Gu, Hyunjin Nam, Sehoon Park

|Mar 28, 2024
Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders.

Hyun Jin Nam, Minkyung Shin, Hye Young Koo

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Frequent Collaborators

2 joint publications

Tae-Young Lee

1 joint publications

Hye Young Koo

1 joint publications

Hee-Chul Lee

1 joint publications

Soobin Park