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Materials (Basel, Switzerland)|June 12, 2026
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic PackagingPengrong Lin, Zirui Tong, Shimeng Xu, et al.
Journal of Chromatography. B, Analytical Technologies in the Biomedical and Life Sciences|July 13, 2019
Development of an online solid-phase extraction-liquid chromatography-mass spectrometric analysis of oxcarbazepine and its active metabolite licarbazepine from plasma with a direct injection stepLihua Qu, Lixuan Pan, Li Wang, et al.
Micromachines|January 6, 2021
Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi<sub>9</sub> Microwire and Au MicrolayerHe Zhang, Shang Wang, Bingying Wu, et al.
Materials (Basel, Switzerland)|June 27, 2025
Flexible Moisture-Electric Generator Based on Vertically Graded GO-rGO/Ag FilmsShujun Wang, Geng Li, Jiayue Wen, et al.
ACS Applied Materials & Interfaces|July 28, 2021
Low-Temperature Co-hydroxylated Cu/SiO<sub>2</sub> Hybrid Bonding Strategy for a Memory-Centric Chip ArchitectureQiushi Kang, Chenxi Wang, Shicheng Zhou, et al.
ACS Applied Materials & Interfaces|December 23, 2021
High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-<i>co</i>-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent ApplicationsHui Fang, Xiaoyun Qi, Shicheng Zhou, et al.
Micromachines|November 15, 2018
Recent Progress in Rapid Sintering of Nanosilver for Electronics ApplicationsWei Liu, Rong An, Chunqing Wang, et al.
ACS Omega|August 29, 2019
One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive InterconnectorsShang Wang, Yanhong Tian, Chenxi Wang, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|June 20, 2024
Microconfined Assembly of High-Resolution and Mechanically Robust EGaIn Liquid Metal Stretchable Electrodes for Wearable Electronic SystemsJingxuan Ma, Zicheng Sa, He Zhang, et al.
RSC Advances|May 11, 2022
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz <i>via</i> VUV/O<sub>3</sub> activationJikai Xu, Chenxi Wang, Te Wang, et al.
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