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Journal of Nanoscience and Nanotechnology|June 25, 2008
Effect of interfacial condition on electromigration for narrow and wide copper interconnectsYi-Lung Cheng, Ying-Lang WangJournal of Nanoscience and Nanotechnology|June 25, 2008
The integration solution of copper barrier deposition for nanometer interconnect processKei-Wei Chen, Ying-Lang Wang, Jung-Chih Tsao, et al.Journal of Nanoscience and Nanotechnology|June 25, 2008
The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric filmsSheng-Wen Chen, Chuan-Pu Liu, Shiu-Ko JangJian, et al.Journal of Nanoscience and Nanotechnology|July 26, 2013
Investigation the electroplating behavior of self formed CuMn barrierChia-Yang Wu, Wen-Hsi Lee, Shih-Chieh Chang, et al.Journal of Nanoscience and Nanotechnology|October 6, 2012
A novel synthesis of a CuInSe2 thin film from electrodeposited Cu-Se-In-Se precursors with three steps annealingShao-Yu Hu, Wen-Hsi Lee, Shih-Chieh Chang, et al.Journal of Nanoscience and Nanotechnology|May 16, 2009
Study of nitrogen diffusion profile of low resistivity diffusion barrier by resputtering technologyJung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, et al.Journal of Nanoscience and Nanotechnology|June 25, 2008
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriersJung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, et al.Journal of Nanoscience and Nanotechnology|December 7, 2010
Effect of under-layer treatment of Ta/TaN barrier film on corrosion between Cu seed and Ta in chemical-mechanical-polishing slurryWen-Hsi Lee, Chi-Cheng Hung, Yu-Sheng Wang, et al.Journal of Nanoscience and Nanotechnology|December 9, 2010
Microstructure and formation of copper oxide in the Cu electro-polishing processTe-Ming Kung, Michael Rong-Shie Huang, Jung-Chih Tsao, et al.Materials (Basel, Switzerland)|August 18, 2017
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based α-SiCN:H/α-SiCO:H Diffusion Barrier FilmsSheng-Wen Chen, Yu-Sheng Wang, Shao-Yu Hu, et al.Pageof 1