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Yinhua Cui

Showing results (1-10 of 14) with videos related to

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Micromachines|December 29, 2019
Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic DevicesYinhua Cui, Jeong Yeul Jeong, Yuan Gao, et al.
Micromachines|February 12, 2020
Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection DeviceYinhua Cui, Jeong Yeul Jeong, Yuan Gao, et al.
Micromachines|December 23, 2022
Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical InterconnectsYao Wang, Chuan Hu, Xun Xiang, et al.
Talanta|June 7, 2025
Photothermal media for ultrafast photonic PCR systems: Response mechanisms, classification and development status, challenges and future prospectsShaohui Zhang, Baijie Cheng, Xun Zhou, et al.
Journal of Nanoscience and Nanotechnology|May 15, 2015
Interface modification in solar cell contact electrode using pre-cleaning treatment chemistriesYinhua Cui, Areum Kim, Seonjea Lee, et al.
Molecular Biology Reports|June 21, 2024
Anti-inflammatory effects of Olive (olea europaea L.) fruit extract in LPS-stimulated RAW264.7 cells via MAPK and NF-κB signal pathwaysYiwen Chen, Yali Zheng, Xia Wen, et al.
Journal of Nanoscience and Nanotechnology|August 7, 2019
Characteristics of Metal-Metal Nano-Area Contact Resistance for Less Than 5 nm Technology NodeEunmi Choi, Yinhua Cui, Yuan Gao, et al.
Materials (Basel, Switzerland)|March 29, 2023
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid AtmosphereSiliang He, Bifu Xiong, Fangyi Xu, et al.
Journal of Nanoscience and Nanotechnology|November 25, 2018
Development of a New Electrochemical Atomic Force Microscopy Tool for Obtaining Surface Morphology Through Electrochemical ReactionLongshou Zheng, Ho Jae Shim, Yinhua Cui, et al.
Frontiers in Microbiology|August 22, 2024
Application of valencene and prospects for its production in engineered microorganismsYafeng Song, Huizhong Liu, Wim J Quax, et al.
Pageof 2

Showing results (1-10 of 14) with videos related to

Sort By:
Pageof 2
Micromachines|December 29, 2019
Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic DevicesYinhua Cui, Jeong Yeul Jeong, Yuan Gao, et al.
Micromachines|February 12, 2020
Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection DeviceYinhua Cui, Jeong Yeul Jeong, Yuan Gao, et al.
Micromachines|December 23, 2022
Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical InterconnectsYao Wang, Chuan Hu, Xun Xiang, et al.
Talanta|June 7, 2025
Photothermal media for ultrafast photonic PCR systems: Response mechanisms, classification and development status, challenges and future prospectsShaohui Zhang, Baijie Cheng, Xun Zhou, et al.
Journal of Nanoscience and Nanotechnology|May 15, 2015
Interface modification in solar cell contact electrode using pre-cleaning treatment chemistriesYinhua Cui, Areum Kim, Seonjea Lee, et al.
Molecular Biology Reports|June 21, 2024
Anti-inflammatory effects of Olive (olea europaea L.) fruit extract in LPS-stimulated RAW264.7 cells via MAPK and NF-κB signal pathwaysYiwen Chen, Yali Zheng, Xia Wen, et al.
Journal of Nanoscience and Nanotechnology|August 7, 2019
Characteristics of Metal-Metal Nano-Area Contact Resistance for Less Than 5 nm Technology NodeEunmi Choi, Yinhua Cui, Yuan Gao, et al.
Materials (Basel, Switzerland)|March 29, 2023
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid AtmosphereSiliang He, Bifu Xiong, Fangyi Xu, et al.
Journal of Nanoscience and Nanotechnology|November 25, 2018
Development of a New Electrochemical Atomic Force Microscopy Tool for Obtaining Surface Morphology Through Electrochemical ReactionLongshou Zheng, Ho Jae Shim, Yinhua Cui, et al.
Frontiers in Microbiology|August 22, 2024
Application of valencene and prospects for its production in engineered microorganismsYafeng Song, Huizhong Liu, Wim J Quax, et al.
Pageof 2