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Youngman Kim

Showing results (1-10 of 11) with videos related to

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Journal of Nanoscience and Nanotechnology|April 2, 2011
The effect of grain size and film thickness on the thermal expansion coefficient of copper thin filmsSeulgi Hwang, Youngman Kim
Journal of Nanoscience and Nanotechnology|November 23, 2011
Grain size and film thickness effect on the thermal expansion coefficient of FCC metallic thin filmsSeulgi Hwang, Youngman Kim
Journal of Nanoscience and Nanotechnology|November 23, 2011
Processing of SiO2 protective layer using HMDS precursor by combustion CVDKyoung-Soo Park, Youngman Kim
Journal of Nanoscience and Nanotechnology|April 3, 2010
Effect of microstructure on thermal conductivity of Cu, Ag thin filmsSang Ryu, Woonam Juhng, Youngman Kim
Journal of Nanoscience and Nanotechnology|April 3, 2010
The effect of surface roughness on in-situ intrinsic tensile stress behavior in Cu thin filmsMoohyun Cho, Sang Ryu, Youngman Kim
Journal of Nanoscience and Nanotechnology|December 1, 2007
Stress behavior of FCC metallic thin films during thermal evaporationSang Ryu, Kyungchun Lee, Seungwhan Ma, et al.
Physical Review Letters|April 25, 2026
Searching for the Tetraneutron Resonance on the LatticeLinqian Wu, Serdar Elhatisari, Ulf-G Meißner, et al.
Plos One|December 18, 2019
The risk of active tuberculosis among individuals living in tuberculosis-affected households in the Republic of Korea, 2015Jiyeon Yang, Sodam Lee, Suhyeon Oh, et al.
Frontiers in Aging Neuroscience|September 27, 2019
Gami-Chunggan Formula Prevents Motor Dysfunction in MPTP/p-Induced and A53T α-Synuclein Overexpressed Parkinson's Disease Mouse Model Though DJ-1 and BDNF ExpressionSora Ahn, Quan Feng Liu, Jae-Hwan Jang, et al.
Nature|May 15, 2024
Wavefunction matching for solving quantum many-body problemsSerdar Elhatisari, Lukas Bovermann, Yuan-Zhuo Ma, et al.
Pageof 2

Showing results (1-10 of 11) with videos related to

Sort By:
Pageof 2
Journal of Nanoscience and Nanotechnology|April 2, 2011
The effect of grain size and film thickness on the thermal expansion coefficient of copper thin filmsSeulgi Hwang, Youngman Kim
Journal of Nanoscience and Nanotechnology|November 23, 2011
Grain size and film thickness effect on the thermal expansion coefficient of FCC metallic thin filmsSeulgi Hwang, Youngman Kim
Journal of Nanoscience and Nanotechnology|November 23, 2011
Processing of SiO2 protective layer using HMDS precursor by combustion CVDKyoung-Soo Park, Youngman Kim
Journal of Nanoscience and Nanotechnology|April 3, 2010
Effect of microstructure on thermal conductivity of Cu, Ag thin filmsSang Ryu, Woonam Juhng, Youngman Kim
Journal of Nanoscience and Nanotechnology|April 3, 2010
The effect of surface roughness on in-situ intrinsic tensile stress behavior in Cu thin filmsMoohyun Cho, Sang Ryu, Youngman Kim
Journal of Nanoscience and Nanotechnology|December 1, 2007
Stress behavior of FCC metallic thin films during thermal evaporationSang Ryu, Kyungchun Lee, Seungwhan Ma, et al.
Physical Review Letters|April 25, 2026
Searching for the Tetraneutron Resonance on the LatticeLinqian Wu, Serdar Elhatisari, Ulf-G Meißner, et al.
Plos One|December 18, 2019
The risk of active tuberculosis among individuals living in tuberculosis-affected households in the Republic of Korea, 2015Jiyeon Yang, Sodam Lee, Suhyeon Oh, et al.
Frontiers in Aging Neuroscience|September 27, 2019
Gami-Chunggan Formula Prevents Motor Dysfunction in MPTP/p-Induced and A53T α-Synuclein Overexpressed Parkinson's Disease Mouse Model Though DJ-1 and BDNF ExpressionSora Ahn, Quan Feng Liu, Jae-Hwan Jang, et al.
Nature|May 15, 2024
Wavefunction matching for solving quantum many-body problemsSerdar Elhatisari, Lukas Bovermann, Yuan-Zhuo Ma, et al.
Pageof 2