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Yuichi Kurashima

Showing results (1-10 of 7) with videos related to

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Scientific Reports|May 28, 2021
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditionsTakashi Matsumae, Ryo Takigawa, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|January 21, 2023
High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion PumpsYuichi Kurashima, Taisei Motomura, Shinya Yanagimachi, et al.
Microsystems & Nanoengineering|January 28, 2022
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packagingShingo Kariya, Takashi Matsumae, Yuichi Kurashima, et al.
Micromachines|February 21, 2019
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au FilmsMichitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|June 27, 2024
Ultra-High Vacuum Cells Realized by Miniature Ion Pump Using High-Efficiency Plasma SourceYuichi Kurashima, Atsuhiko Maeda, Naoto Oshima, et al.
Micromachines|May 1, 2020
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated BondingMichitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|November 11, 2022
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum PackagingTakashi Matsumae, Shingo Kariya, Yuichi Kurashima, et al.
Pageof 1

Showing results (1-10 of 7) with videos related to

Sort By:
Pageof 1
Scientific Reports|May 28, 2021
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditionsTakashi Matsumae, Ryo Takigawa, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|January 21, 2023
High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion PumpsYuichi Kurashima, Taisei Motomura, Shinya Yanagimachi, et al.
Microsystems & Nanoengineering|January 28, 2022
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packagingShingo Kariya, Takashi Matsumae, Yuichi Kurashima, et al.
Micromachines|February 21, 2019
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au FilmsMichitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|June 27, 2024
Ultra-High Vacuum Cells Realized by Miniature Ion Pump Using High-Efficiency Plasma SourceYuichi Kurashima, Atsuhiko Maeda, Naoto Oshima, et al.
Micromachines|May 1, 2020
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated BondingMichitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, et al.
Sensors (Basel, Switzerland)|November 11, 2022
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum PackagingTakashi Matsumae, Shingo Kariya, Yuichi Kurashima, et al.
Pageof 1