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Langmuir : the ACS Journal of Surfaces and Colloids|January 11, 2018
Controlled Growth and Grafting of High-Density Au Nanoparticles on Zinc Oxide Thin Films by Photo-DepositionJérémy Cure, Hala Assi, Kévin Cocq, et al.
Scientific Reports|February 4, 2017
Order of magnitude enhancement of monolayer MoS2 photoluminescence due to near-field energy influx from nanocrystal filmsTianle Guo, Siddharth Sampat, Kehao Zhang, et al.
Journal of the American Chemical Society|September 11, 2018
Modulation of Water Vapor Sorption by a Fourth-Generation Metal-Organic Material with a Rigid Framework and Self-Switching PoresShi-Yuan Zhang, Stephanie Jensen, Kui Tan, et al.
Langmuir : the ACS Journal of Surfaces and Colloids|March 16, 2013
Gold nanoparticles on oxide-free silicon-molecule interface for single electron transportLouis Caillard, Oliver Seitz, Philip M Campbell, et al.
Nature Communications|December 14, 2016
Trapping gases in metal-organic frameworks with a selective surface molecular barrier layerKui Tan, Sebastian Zuluaga, Erika Fuentes, et al.
ACS Applied Materials & Interfaces|April 23, 2014
Silicon interfacial passivation layer chemistry for high-k/InP interfacesHong Dong, Wilfredo Cabrera, Xiaoye Qin, et al.
The Journal of Chemical Physics|February 10, 2017
Substrate selectivity in the low temperature atomic layer deposition of cobalt metal films from bis(1,4-di-tert-butyl-1,3-diazadienyl)cobalt and formic acidMarissa M Kerrigan, Joseph P Klesko, Sara M Rupich, et al.
ACS Applied Materials & Interfaces|August 5, 2014
Elementary surface chemistry during CuO/Al nanolaminate-thermite synthesis: copper and oxygen deposition on aluminum (111) surfacesCloé Lanthony, Mathilde Guiltat, Jean Marie Ducéré, et al.
ACS Applied Materials & Interfaces|September 5, 2018
Thermal Atomic Layer Etching of Silica and Alumina Thin Films Using Trimethylaluminum with Hydrogen Fluoride or FluoroformRezwanur Rahman, Eric C Mattson, Joseph P Klesko, et al.
ACS Applied Materials & Interfaces|May 20, 2015
Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the InterfacesLorena Marín, Charith E Nanayakkara, Jean-Francois Veyan, et al.
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