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ACS Applied Materials & Interfaces|March 16, 2019
Flexible, Temperature-Resistant, and Fatigue-Free Ferroelectric Memory Based on Bi(Fe0.93Mn0.05Ti0.02)O3 Thin FilmChanghong Yang, Yajie Han, Jin Qian, et al.
Materials Horizons|January 3, 2025
Controllable topological phase transition via ferroelectric-paraelectric switching in a ferromagnetic single-layer MIMIIGe2X6 familyJingbo Bai, Tie Yang, Zhenzhou Guo, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|June 17, 2025
Designing Spin Symmetry for Altermagnetism with Strong Magnetoelectric CouplingWei Sun, Wenxuan Wang, Changhong Yang, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|June 12, 2026
2D Inorganic Electrides: Interstitial Electrons as Key Drivers of Multifunctional Properties and ApplicationsQianwen Zhang, Xia Cheng, Zhenzhou Guo, et al.
Physical Chemistry Chemical Physics : PCCP|September 18, 2013
Manipulation of domain wall mobility by oxygen vacancy ordering in multiferroic YMnO3Yi Du, Xiaolin Wang, Dapeng Chen, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|January 25, 2026
Electric-Field Control of Terahertz Response via Spin-Corner-Layer Coupling in Altermagnetic BilayersJianhua Wang, Yilin Han, Shifeng Qian, et al.
Advanced Materials (Deerfield Beach, Fla.)|April 29, 2024
Hidden Real Topology and Unusual Magnetoelectric Responses in Two-Dimensional AntiferromagnetsJialin Gong, Yang Wang, Yilin Han, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|July 27, 2026
Ferroelectric Catalysts in the Hydrogen Evolution Reaction: A PerspectiveRongxuan Lu, Weizhen Meng, Zhenxiang Cheng, et al.
RSC Advances|May 6, 2022
Graphitic carbon nitride with thermally-induced nitrogen defects: an efficient process to enhance photocatalytic H2 production performanceGuangzhi Dong, Yun Wen, Huiqing Fan, et al.
Physical Chemistry Chemical Physics : PCCP|June 26, 2019
Seeking large Seebeck effects in LaX(X = Mn and Co)O3/SrTiO3 superlattices by exploiting high spin-polarized effectsJingyu Li, Yuanxu Wang, Guangbiao Zhang, et al.
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