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Nanotechnology|July 29, 2009
Fabrication and characterization of cellular iron nanocrystalline filmWei Zhang, Zhi-Quan Liu, Kazuo Furuya
Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada|October 17, 2009
Dynamic Monte Carlo simulation on the electron-beam-induced deposition of carbon, silver, and tungsten supertipsZhi-Quan Liu, Kazutaka Mitsuishi, Kazuo Furuya
Nan Fang Yi Ke Da Xue Xue Bao = Journal of Southern Medical University|January 30, 2008
[Effects of chronic salt loading on blood pressure and arterial chloride channel expression in rats with a two-week-long angiotensin II exposure]Yuan Fang, Zhi-Quan Liu, Yong Zheng
Materials (Basel, Switzerland)|June 27, 2024
Research Overview on the Electromigration Reliability of SnBi Solder AlloyWenjie Li, Liwei Guo, Dan Li, et al.
Nanotechnology|June 2, 2025
Review of Cu-Cu direct bonding technology in advanced packagingZe-Hao Zhao, Li-Yin Gao, Zhi-Quan Liu
Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada|August 8, 2013
Microstructural study on Kirkendall void formation in Sn-containing/Cu solder joints during solid-state agingZhi-Quan Liu, Pan-Ju Shang, Feifei Tan, et al.
Materials (Basel, Switzerland)|August 5, 2017
Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder LayerLiang Zhang, Zhi-Quan Liu, Fan Yang, et al.
Journal of Environmental Sciences (China)|December 8, 2007
Sensitivity of key factors and uncertainties in health risk assessment of benzene pollutantZhi-quan Liu, Ying-hua Zhang, Guang-he Li, et al.
Huan Jing Ke Xue= Huanjing Kexue|September 26, 2007
[Uncertainty analysis of health risk assessment caused by benzene contamination in a contaminated site]Ying-hua Zhang, Zhi-quan Liu, Guang-he Li, et al.
ACS Applied Materials & Interfaces|April 27, 2019
Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic EncapsulationJie Yuan, Xitang Qian, Zhichao Meng, et al.
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