Showing results (11-20 of 32) with videos related to
Sort By:
Pageof 4
Journal of Materials Science. Materials in Electronics|April 16, 2024
Influence of Mg substitution on structural, magnetic and electrical properties of Zn-Cu ferritesMd Johurul Islam, M Jhahan, M T Khatun, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Synthesis of chitosan-grafted poly-acrylic acid (CTS-g-PAA) hydrogel and its potential application in biosensors for signal enhancing and bioanalysisEsmaeel Alipour, Sheida Norouzi, Hajar Yousefzadeh, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Bio-fabrication of thermozyme-based nano-biosensors: their components and present scenarioSnehi Soy, Shubha Rani Sharma, Vinod Kumar NigamJournal of Materials Science. Materials in Electronics|April 16, 2024
A nanostructured Al-doped ZnO as an ultra-sensitive room-temperature ammonia gas sensorBantikatla Himabindu, N S M P Latha Devi, Pothukanuri Nagaraju, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Influence of Ni2+ ions on the structural, morphological, photoluminescence, photo-catalytic and anti-bacterial studies of Cd0.9Zn0.1S nanostructuresP Raju, Joseph Prince Jesuraj, S MuthukumaranJournal of Materials Science. Materials in Electronics|April 16, 2024
Largely enhanced luminescence intensity and improved optical temperature sensing properties in CaWO4-La2(WO4)3: Er3+, Yb3+ via regulating cations compositionYing Zhang, Xusheng Wang, Qian Liu, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Preparation of MgO-MnO2 nanocomposite particles for cholesterol sensorsAlaa A Abdul-Hamead, Farhad M Othman, Makram A FakhriJournal of Materials Science. Materials in Electronics|February 20, 2025
On fault-tolerant Boolean functions in proteinoids-ZnO colloidsNoushin Raeisi Kheirabadi, Panagiotis Mougkogiannis, Raphael Fortulan, et al.Journal of Materials Science. Materials in Electronics|February 29, 2024
Ceramic-to-metal bonding using rare-earth containing Sn-Bi solderTianshi Feng, Bhabana Pati, Ka Man Chung, et al.Journal of Materials Science. Materials in Electronics|October 27, 2025
Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cyclingC L Hsieh, R J Coyle, S A Belyakov, et al.Pageof 4