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Microsystems & Nanoengineering|December 16, 2024
The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing processYang Xi, Yunpeng Zhang, Zhiqaing Tian, et al.
Microsystems & Nanoengineering|February 12, 2025
Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integrationTianjian Liu, Shizhao Wang, Fang Dong, et al.
Microsystems & Nanoengineering|February 26, 2025
Hollow fiber-based strain sensors with desirable modulus and sensitivity at effective deformation for dexterous electroelastomer cylindrical actuatorYang Zhang, Keqi Deng, Tingting Shen, et al.
Microsystems & Nanoengineering|January 20, 2025
Finite element-based nonlinear dynamic optimization of nanomechanical resonatorsZichao Li, Farbod Alijani, Ali Sarafraz, et al.
Microsystems & Nanoengineering|January 19, 2025
System-level modeling with temperature compensation for a CMOS-MEMS monolithic calorimetric flow sensing SoCLinze Hong, Ke Xiao, Xiangyu Song, et al.
Microsystems & Nanoengineering|January 15, 2025
Flexible micromachined ultrasound transducers (MUTs) for biomedical applicationsSanjog Vilas Joshi, Sina Sadeghpour, Nadezda Kuznetsova, et al.
Microsystems & Nanoengineering|January 15, 2025
A novel wearable device integrating ECG and PCG for cardiac health monitoringJunbin Zang, Qi An, Bo Li, et al.
Microsystems & Nanoengineering|March 4, 2025
Global alignment reference strategy for laser interference lithography pattern arraysXiang Gao, Jingwen Li, Zijian Zhong, et al.
Microsystems & Nanoengineering|March 2, 2025
Nanoplasmonic SERS on fidget spinner for digital bacterial identificationMamata Karmacharya, Issac Michael, Jiyun Han, et al.
Microsystems & Nanoengineering|March 7, 2025
Harnessing exceptional points for ultrahigh sensitive acoustic wave sensingXingyu Lu, Yang Yuan, Fa Chen, et al.
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