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Nanomaterials (Basel, Switzerland)|May 28, 2022
Pinning Potential of the Self-Assembled Artificial Pinning Centers in Nanostructured YBa2Cu3O7-x Superconducting FilmsIon Ivan, Alina M Ionescu, Daniel N Crisan, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Study of Electronic and Transport Properties in Double-Barrier Resonant Tunneling SystemsJohn A Gil-Corrales, Juan A Vinasco, Miguel E Mora-Ramos, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Transmissive Polarizer Metasurfaces: From Microwave to Optical RegimesAyesha Kosar Fahad, Cunjun Ruan, Rabia Nazir, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Novel Modeling Approach to Analyze Threshold Voltage Variability in Short Gate-Length (15-22 nm) Nanowire FETs with Various Channel DiametersSeunghwan Lee, Jun-Sik Yoon, Junjong Lee, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Photothermal Conversion Profiling of Large-Scaled Synthesized Gold Nanorods Using Binary Surfactant with Hydroquinone as a Reducing AgentThabang Calvin Lebepe, Oluwatobi Samuel Oluwafemi
Nanomaterials (Basel, Switzerland)|May 28, 2022
B, O and N Codoped Biomass-Derived Hierarchical Porous Carbon for High-Performance Electrochemical Energy StorageShuying Kong, Xinzhu Xiang, Binbin Jin, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Ion-Movement-Based Synaptic Device for Brain-Inspired ComputingChansoo Yoon, Gwangtaek Oh, Bae Ho Park
Nanomaterials (Basel, Switzerland)|May 28, 2022
Tunable Dual-Broadband Terahertz Absorber with Vanadium Dioxide MetamaterialHengli Feng, Zuoxin Zhang, Jingyu Zhang, et al.
Nanomaterials (Basel, Switzerland)|May 28, 2022
Effects of Electrodes Layout and Filler Scale on Percolation Threshold and Piezoresistivity Performances of a Cementitious-Based GeocompositeMohammadmahdi Abedi, Raul Fangueiro, António Gomes Correia
Nanomaterials (Basel, Switzerland)|May 28, 2022
Static and Free Vibration Analyses of Single-Walled Carbon Nanotube (SWCNT)-Substrate Medium SystemsSuchart Limkatanyu, Worathep Sae-Long, Hamid Mohammad-Sedighi, et al.
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