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Science and Technology of Advanced Materials|November 24, 2016
Antifouling properties of hydrogelsTakayuki Murosaki, Nafees Ahmed, Jian Ping GongScience and Technology of Advanced Materials|November 24, 2016
The toughening mechanism of nacre and structural materials inspired by nacreHideki Kakisawa, Taro SumitomoScience and Technology of Advanced Materials|November 24, 2016
Soft x-ray reflectometry, hard x-ray photoelectron spectroscopy and transmission electron microscopy investigations of the internal structure of TiO2(Ti)/SiO2/Si stacksElena O Filatova, Igor V Kozhevnikov, Andrey A Sokolov, et al.Science and Technology of Advanced Materials|November 24, 2016
Can the use of pulsed direct current induce oscillation in the applied pressure during spark plasma sintering?David Salamon, Mirva Eriksson, Mats Nygren, et al.Science and Technology of Advanced Materials|November 24, 2016
Photoinduced superhydrophilicity of TiO2 thin film with hierarchical Cu dopingZhifeng Liu, Yun Wang, Xinli Peng, et al.Science and Technology of Advanced Materials|November 24, 2016
Versatile sputtering technology for Al2O3 gate insulators on grapheneMiriam Friedemann, Mirosław Woszczyna, André Müller, et al.Science and Technology of Advanced Materials|November 24, 2016
Effective lattice stabilization of gadolinium aluminate garnet (GdAG) via Lu3+ doping and development of highly efficient (Gd,Lu)AG:Eu3+ red phosphorsJinkai Li, Ji-Guang Li, Zhongjie Zhang, et al.Science and Technology of Advanced Materials|November 24, 2016
Electrospinning of aligned fibers with adjustable orientation using auxiliary electrodesMatthias M L Arras, Christian Grasl, Helga Bergmeister, et al.Science and Technology of Advanced Materials|November 24, 2016
Progress of key strategies in development of electrospun scaffolds: bone tissueSumit Pramanik, Belinda Pingguan-Murphy, Noor Azuan Abu OsmanScience and Technology of Advanced Materials|November 24, 2016
Hydrothermal synthesis and properties of NiFe2O4@BaTiO3 composites with well-matched interfaceJian-Ping Zhou, Li Lv, Qian Liu, et al.Pageof 151