Jiayi Fang
6PUBLICATIONS
6CO-AUTHORS
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Publications (6)
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|Feb 01, 2026
Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study.Junwei Chen, Zezhan Li, Bin Yang
|Dec 28, 2019
Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints.Jiajie Fan, Jie Wu, Changzhen Jiang
|Sep 28, 2019
Investigation of Step-Stress Accelerated Degradation Test Strategy for Ultraviolet Light Emitting Diodes.Banglong Liang, Zili Wang, Cheng Qian
|Apr 11, 2019
Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package.Yongjun Pan, Fulong Zhu, Jiajie Fan
|Oct 17, 2017
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.Cheng Qian, Jiajie Fan, Jiayi Fang
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