Abu Riduan Md Foisal
6PUBLICATIONS
9CO-AUTHORS
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Publications (6)
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|May 11, 2022
A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding.Abu Riduan Md Foisal, Hoang-Phuong Phan, Toan Dinh
|Nov 09, 2021
Generation of a Charge Carrier Gradient in a 3C-SiC/Si Heterojunction with Asymmetric Configuration.Tuan-Hung Nguyen, Thanh Nguyen, Abu Riduan Md Foisal
|Jul 08, 2021
Piezoresistive Effect with a Gauge Factor of 18 000 in a Semiconductor Heterojunction Modulated by Bonded Light-Emitting Diodes.Thanh Nguyen, Toan Dinh, Van Thanh Dau
|Jun 11, 2020
Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics.T Dinh, T Nguyen, A R M Foisal
|Oct 04, 2019
3C-SiC/Si Heterostructure: An Excellent Platform for Position-Sensitive Detectors Based on Photovoltaic Effect.Abu Riduan Md Foisal, Thanh Nguyen, Toan Dinh
|Nov 04, 2017
Pushing the Limits of Piezoresistive Effect by Optomechanical Coupling in 3C-SiC/Si Heterostructure.Abu Riduan Md Foisal, Afzaal Qamar, Hoang-Phuong Phan
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Frequent Collaborators
5 joint publications
Tuan-Khoa Nguyen
4 joint publications
Toan Dinh
4 joint publications
Hoang-Phuong Phan
4 joint publications
Dzung Viet Dao
3 joint publications
Thanh Nguyen
2 joint publications
Nam-Trung Nguyen
2 joint publications
Tuan-Hung Nguyen
1 joint publications
Afzaal Qamar
1 joint publications
Trung-Hieu Vu
