Daquan Yu
6PUBLICATIONS
4CO-AUTHORS
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Publications (6)
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|Sep 27, 2025
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics.Han Gao, Wanyi Yan, Dan Zhang
|Mar 27, 2025
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters.Xinyue Liu, Wenjiao Pei, Jin Zhao
|Jan 11, 2024
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.Chen Yu, Shaocheng Wu, Yi Zhong
|Oct 27, 2022
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection.Jin Zhao, Zuohuan Chen, Fei Qin
|Aug 12, 2022
Development of a Reliable High-Performance WLP for a SAW Device.Zuohuan Chen, Daquan Yu
|Mar 26, 2022
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.Zuohuan Chen, Daquan Yu, Yi Zhong
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