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Daquan Yu

6PUBLICATIONS

4CO-AUTHORS

Photonic and electro-optical devices, sensors and systems (excl. communications)Wireless communication systems and technologies (incl. microwave and millimetrewave)GlassOptical fibre communication systems and technologiesPhotovoltaic power systems

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Publications (6)

Sort by Publication Date:

|Sep 27, 2025

Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics.

Han Gao, Wanyi Yan, Dan Zhang

|Mar 27, 2025

A Review of Wafer-Level Packaging Technology for SAW and BAW Filters.

Xinyue Liu, Wenjiao Pei, Jin Zhao

|Jan 11, 2024

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.

Chen Yu, Shaocheng Wu, Yi Zhong

|Oct 27, 2022

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection.

Jin Zhao, Zuohuan Chen, Fei Qin

|Aug 12, 2022

Development of a Reliable High-Performance WLP for a SAW Device.

Zuohuan Chen, Daquan Yu

|Mar 26, 2022

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.

Zuohuan Chen, Daquan Yu, Yi Zhong

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Frequent Collaborators

3 joint publications

Zuohuan Chen

2 joint publications

Rongbin Xu

1 joint publications

Han Gao

1 joint publications

Wanyi Yan

Frequent Collaborators

3 joint publications

Zuohuan Chen

2 joint publications

Rongbin Xu

1 joint publications

Han Gao

1 joint publications

Wanyi Yan

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