Rongbin Xu

2PUBLICATIONS
1CO-AUTHORS
Wireless communication systems and technologies (incl. microwave and millimetrewave)Glass
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Publications (2)

|Mar 27, 2025
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters.

Xinyue Liu, Wenjiao Pei, Jin Zhao

|Jan 11, 2024
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.

Chen Yu, Shaocheng Wu, Yi Zhong

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Frequent Collaborators

2 joint publications

Daquan Yu