JeongWon Yoon

3PUBLICATIONS
1CO-AUTHORS
Composite and hybrid materialsCompound semiconductorsCeramics
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Publications (3)

|Jun 12, 2026
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering.

|Nov 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.

Taejoon Noh, Eun-Chae Noh, Minjae Sung

|Oct 31, 2018
Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications.

Jeong-Won Yoon, Jong-Hoon Back

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Frequent Collaborators

1 joint publications

Taejoon Noh