Zhiming Chen
4PUBLICATIONS
6CO-AUTHORS

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Publications (4)
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|Oct 28, 2025
A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing.Yigang Hao, Yingtao Ding, Ziyue Zhang
|Apr 27, 2024
Secure ECDSA SRAM-PUF Based on Universal Single/Double Scalar Multiplication Architecture.Jingqi Zhang, Zhiming Chen, Xiang He
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