Rong Sun

54PUBLICATIONS
60CO-AUTHORS
Polymers and plasticsComposite and hybrid materialsElectrical energy transmission, networks and systemsFluid-structure interaction and aeroacousticsEngineering electromagnetics
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Publications (54)

|Aug 05, 2026
Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives.

|Dec 17, 2025
Inhomogeneous Interfacial Layer: A Hidden Cause of High Thermal Contact Resistance in Polymer-Based Thermal Interface Materials with Spherical Fillers.

Hang Shi, Xuancheng Li, Ting Liang

|Nov 26, 2025
Thickness-Dependent Macroscopic Properties of Highly Filled Composite Elastomers: Role of Hierarchical Filler Network and Viscoelastic Behavior.

Jianfeng Fan, Dongliang Ding, Chunyu Wong

|Aug 08, 2025
Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion.

Zhaoyu Lin, Xin Luo, Jianhui Zeng

|Jul 04, 2025
Thermally conductive under-liquid adhesives via the synergistic effect of intrinsic interfacial toughness and mechanical dissipation.

Xiangchao Xie, Jianfeng Fan, Chen Zeng

|Apr 03, 2025
Electrically Insulating yet Excellent EMI Shielding FeSiAl/CNF Composite Film with Thermal Conductivity for Electronic Packaging Applications.

Zeyu Zheng, Xinyin Gu, Si-Yuan Liao

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Frequent Collaborators

19 joint publications

Chingping Wong

18 joint publications

Xiaoliang Zeng

15 joint publications

Jianbin Xu

8 joint publications

Pengli Zhu