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Rong Sun

53PUBLICATIONS

59CO-AUTHORS

Polymers and plasticsComposite and hybrid materialsElectrical energy transmission, networks and systemsFluid-structure interaction and aeroacousticsEngineering electromagnetics

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Publications (53)

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|Dec 17, 2025

Inhomogeneous Interfacial Layer: A Hidden Cause of High Thermal Contact Resistance in Polymer-Based Thermal Interface Materials with Spherical Fillers.

Hang Shi, Xuancheng Li, Ting Liang

|Nov 26, 2025

Thickness-Dependent Macroscopic Properties of Highly Filled Composite Elastomers: Role of Hierarchical Filler Network and Viscoelastic Behavior.

Jianfeng Fan, Dongliang Ding, Chunyu Wong

|Aug 08, 2025

Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion.

Zhaoyu Lin, Xin Luo, Jianhui Zeng

|Jul 04, 2025

Thermally conductive under-liquid adhesives <i>via</i> the synergistic effect of intrinsic interfacial toughness and mechanical dissipation.

Xiangchao Xie, Jianfeng Fan, Chen Zeng

|Apr 03, 2025

Electrically Insulating yet Excellent EMI Shielding FeSiAl/CNF Composite Film with Thermal Conductivity for Electronic Packaging Applications.

Zeyu Zheng, Xinyin Gu, Si-Yuan Liao

|Oct 29, 2024

Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials.

Jiashuo Sheng, Zhian Zhang, Yunsong Pang

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Frequent Collaborators

19 joint publications

Chingping Wong

17 joint publications

Xiaoliang Zeng

15 joint publications

Jianbin Xu

8 joint publications

Pengli Zhu

7 joint publications

Cheng-Te Lin

7 joint publications

Yougen Hu

7 joint publications

Yimin Yao

6 joint publications

Wen Dai

6 joint publications

Jinhong Yu

5 joint publications

Shigeo Maruyama

Frequent Collaborators

19 joint publications

Chingping Wong

17 joint publications

Xiaoliang Zeng

15 joint publications

Jianbin Xu

8 joint publications

Pengli Zhu

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