Wen Dai

10PUBLICATIONS
16CO-AUTHORS
Metals and alloy materialsOrganic semiconductorsElectrical energy transmission, networks and systemsPolymers and plasticsWireless communication systems and technologies (incl. microwave and millimetrewave)
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Publications (10)

|Jun 09, 2026
Electrically Insulating Thermal Putty with High Thermal Conductivity and Low Thermal Resistance through Interface Modulation of Al2O3/AlN with Liquid Metal.

|Aug 05, 2024
van der Waals-bonded graphene clusters enhance thermal conductivity of phase-change materials for advanced thermal energy management.

Liwen Sun, Yandong Wang, Lu Chen

|Feb 02, 2024
High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management.

Juncheng Xia, Xiangdong Kong, Linhong Li

|Nov 07, 2022
Correction to Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates.

Junfeng Ying, Xue Tan, Le Lv

|Jul 26, 2022
A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites.

Qingwei Yan, Jingyao Gao, Ding Chen

|Jun 08, 2022
Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2T MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface.

Xue Tan, Te-Huan Liu, Wenjiang Zhou

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Frequent Collaborators

10 joint publications

Jinhong Yu

10 joint publications

Cheng-Te Lin

6 joint publications

Rong Sun

5 joint publications

Chingping Wong