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Xing Fu

3PUBLICATIONS

3CO-AUTHORS

Microfluidics and nanofluidicsElectrical energy generation (incl. renewables, excl. photovoltaics)Pyrometallurgy

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Publications (3)

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|Feb 11, 2023

Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing.

Zhiwei Fu, Jian Chen, Pengfei Zhao

|Jan 11, 2022

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration.

Kexin Xu, Xing Fu, Xinjie Wang

|Dec 05, 2020

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.

Xing Fu, Min Liu, KeXin Xu

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Frequent Collaborators

1 joint publications

Zhiwei Fu

1 joint publications

Xiaotong Guo

1 joint publications

Jia-Yue Yang

Frequent Collaborators

1 joint publications

Zhiwei Fu

1 joint publications

Xiaotong Guo

1 joint publications

Jia-Yue Yang

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