Xing Fu
3PUBLICATIONS
3CO-AUTHORS
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Publications (3)
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|Feb 11, 2023
Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing.Zhiwei Fu, Jian Chen, Pengfei Zhao
|Jan 11, 2022
The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration.Kexin Xu, Xing Fu, Xinjie Wang
|Dec 05, 2020
The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.Xing Fu, Min Liu, KeXin Xu
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