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The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

Kexin Xu1,2,3, Xing Fu4,2, Xinjie Wang1,3

  • 1Department of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China.

Materials (Basel, Switzerland)
|January 11, 2022
PubMed

Keywords:
IMC accumulationcopper pillarelectromigrationgrain orientationpreferred orientation

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