Chuantong Chen
2PUBLICATIONS
3CO-AUTHORS
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Publications (2)
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|Nov 06, 2019
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining.Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao
|Nov 30, 2018
Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.Chanyang Choe, Chuantong Chen, Seungjun Noh
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