Seungjun Noh
2PUBLICATIONS
2CO-AUTHORS
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Publications (2)
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|Dec 15, 2018
Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors.Seungjun Noh, Hao Zhang, Katsuaki Suganuma
|Nov 30, 2018
Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.Chanyang Choe, Chuantong Chen, Seungjun Noh
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