Yanpeng Gong

1PUBLICATIONS
3CO-AUTHORS
Circuits and systems
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Publications (1)

|Mar 11, 2023
Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling.

Tong An, Xueheng Zheng, Fei Qin

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Frequent Collaborators

1 joint publications

Tong An

1 joint publications

Yanwei Dai

1 joint publications

Pei Chen