Pei Chen
3PUBLICATIONS
4CO-AUTHORS
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Publications (3)
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|Nov 27, 2025
Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO2 Hybrid Bonding.Yiming Hao, Si Chen, Chao Li
|Mar 06, 2025
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging.Dejian Li, Bofu Li, Shunfeng Han
|Mar 11, 2023
Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling.Tong An, Xueheng Zheng, Fei Qin
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