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Mariappan Murugesan

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Publications (1)

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|Nov 09, 2018

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura

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Takafumi Fukushima

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Takafumi Fukushima

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