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Ping-Feng Pai

4PUBLICATIONS

2CO-AUTHORS

Computational methods in fluid flow, heat and mass transfer (incl. computational fluid dynamics)Power electronicsAnalog electronics and interfacesBusiness information management (incl. records, knowledge and intelligence)

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Publications (4)

Sort by Publication Date:

|Mar 27, 2025

Predicting Thermal Resistance of Packaging Design by Machine Learning Models.

Jung-Pin Lai, Shane Lin, Vito Lin

|Feb 25, 2023

Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis.

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin

|Aug 26, 2022

RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques.

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin

|Aug 25, 2018

Using Internet Search Trends and Historical Trading Data for Predicting Stock Markets by the Least Squares Support Vector Regression Model.

Ping-Feng Pai, Ling-Chuang Hong, Kuo-Ping Lin

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Frequent Collaborators

3 joint publications

Jung-Pin Lai

1 joint publications

Ying-Lei Lin

Frequent Collaborators

3 joint publications

Jung-Pin Lai

1 joint publications

Ying-Lei Lin

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