Jung-Pin Lai
3PUBLICATIONS
2CO-AUTHORS

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Publications (3)
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|Mar 27, 2025
Predicting Thermal Resistance of Packaging Design by Machine Learning Models.Jung-Pin Lai, Shane Lin, Vito Lin
|Feb 25, 2023
Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis.Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin
|Aug 26, 2022
RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques.Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin
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