Jung-Pin Lai

3PUBLICATIONS
2CO-AUTHORS
Computational methods in fluid flow, heat and mass transfer (incl. computational fluid dynamics)Power electronicsAnalog electronics and interfaces
Featured researcher

Get your video featured.

JoVEPublish with JoVE
Journal

Publications (3)

|Mar 27, 2025
Predicting Thermal Resistance of Packaging Design by Machine Learning Models.

Jung-Pin Lai, Shane Lin, Vito Lin

|Feb 25, 2023
Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis.

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin

|Aug 26, 2022
RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques.

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin

Pageof 1